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New Product Demonstrations at Sea Air Space Conference 2014

At the 2014 Sea Air Space Show in Maryland, April 7 – 9, United Electronic Industries (UEI) will demonstrate the newly released DNR-MIL and DNA-Mil Data Acquisition and Embedded Control Chassis. These Mil-Grade platforms are ruggedized, performance optimized, designed to meet key elements of MIL-STD-461/810/1275 and guaranteed to withstand 5 g vibration and 100 g shock for the most environmentally challenging I/O applications.

The 2014 Sea Air Space Exposition will be held on April 7-9 at the Gaylord National Convention Center in National Harbor, MD.

The 2014 Sea Air Space Exposition will be held on April 7-9 at the Gaylord National Convention Center in National Harbor, MD.

Configurable as either a stand-alone or computer-hosted system, these I/O test and embedded control instruments are 100% COTS solutions, meaning they are modular and customizable for handling any analog, digital, interface, sensor/transducer input or output. Their rugged IP66/NEMA6 sealed chassis allow for in-field deployments without any additional enclosure or protection required.

For long-life I/O systems like Line Replaceable Units (LRUs) and VME-based systems that will soon face end-of-life availability issues, UEI guarantees at least 10 years of post-purchase product availability. Extensive software support includes all popular OS, RTOS and DAQ (data acquisition) applications, including Linux, VxWorks, Windows, MATLAB, Simulink, QNX and RTX to name a few.

The new DNA-MIL and DNR-MIL platforms are designed for MIL-STD-461/810/1275 compliance and for environmentally harsh I/O acquisition and control applications.

The new DNA-MIL and
DNR-MIL platforms are designed for MIL-STD-461/810/1275
compliance and for environmentally harsh I/O acquisition and control applications.

Much like it’s predecessor systems, the DNX-MIL products are made in the USA and supported by UEI’s extensive line of of analog, digital and interface I/O boards for thermocouples, RTDs, ICP/IEPE, ARINC-429, AFDX, MIL-STD-1553, CANbus, RVDT/LVDT, synchro/resolver, RS 232/422/485 strain gauge, quadrature encoder, high-voltage analog outputs, high drive current, analog inputs up to 24-bits, arbitrary waveform generation and much more.

For the most robust I/O connectivity with on-board Built-In-Test (BIT) diagnostics to ensure maximum uptime and failsafe operation, the DNx-MIL Chassis can’t be beat.  Give us a call for more details.

MIL-Grade DAQ & I/O Control Chassis Make Debut

DNx-MIL SeriesTwo new rugged DAQ (Data Acquisition) and I/O Control platforms promise military-grade reliability and COTS configurability. The DNR-MIL and DNA-MIL are designed for MIL-STD-461/810/1275 compliance and deployment in harsh environments involving military and aerospace computing, oil drilling platforms and storage refineries, heavy machinery, outdoor test stands and other I/O applications. Both platforms offer several technological advantages, including the ability to create a configurable COTS-based solution for virtually any analog/digital I/O sensor, interface and control application.

Learn more.

Quick Lesson in Non-Linearity

As its name implies, non-linearity is the difference between the graph of the input measurement versus actual voltage and the straight line of an “ideal” measurement. The non-linearity error is composed of two components, integral non-linearity (INL) and differential non linearity (DNL). Of the two, integral non-linearity is typically the specification of importance in most data acquisition (DAQ) systems.

INL is the maximum deviation between the ideal output of a DAC and the actual output level (after offset and gain errors have been removed).

INL is the maximum deviation between the ideal output of a DAC and the actual output level (after offset and gain errors have been removed).

INL: The specification is commonly provided in “bits” and describes the maximum error contribution due to the deviation of the voltage versus reading curve from a straight line. Though a somewhat difficult concept to describe textually, INL is easily described graphically and is depicted in Figure 4. Depending on the type of A/D converter used, the INL specification can range from less than 1 LSB to many, or even tens, of LSBs.

DNL: Differential non-linearity describes the “jitter” between the input voltage differential required for the A/D converter to increase (or decrease) by one bit. The output of an ideal A/D converter will increment (or decrement) one LSB each time the input voltage increases (or decreases) by an amount exactly equal to the system resolution.

DNL is the deviation between two analog values corresponding to adjacent input digital values.

DNL is the deviation between two analog values corresponding to adjacent input digital values.

For example, in a 24-bit system with a 10-volt input range, the resolution per bit is 0.596 microvolt. Real A/D converters, however, are not ideal and the voltage change required to increase or decrease the digital output varies. DNL is typically ±1 LSB or less. A DNL specification greater than ±1 LSB indicates it is possible for there to be “missing” codes. Though not as problematic as a non-monotonic D/A converter, A/D missing codes do compromise measurement accuracy.

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Temperature Effects in Strain Measurement

Temperature adversely impacts strain measurements in many ways, though three are of primary concern:
• The device or object studied will almost always have a non-zero coefficient of thermal expansion. Unless compensated for, changes in temperature will cause the item to which the strain gauge is attached to expand or contract, which is then indicated as a change in strain.
• The materials of the strain gauge itself have a non-zero coefficient of thermal expansion. Changes in temperature will cause the strain gauge itself to expand or contract, independent of any strain in the part to which it is attached.
• The wiring and the strain gauge itself will have a non-zero Temperature Coefficient of Resistance. That is, as the temperature changes, the resistance of the strain gauge and connecting wires will change independently of any change in strain. (For example, copper wire resistance changes at approximately 3,900 ppm per °C (.393% /°C).)

Some texts treat the first two items as the same effect. After all, if the coefficients of expansion of the gauge and the item under test are the same, they will contract or expand at the same rates in response to a temperature change. In this case, a change in system temperature would not cause any change in the indicated strain, except that based on the gauge’s temperature coefficient of resistance.

It’s important to note that in some applications, it may be desirable or even critical that strain induced by temperature changes be noted. Imagine an application where a “hot section” turbine blade is being tested to ensure proper clearance between the blade tip and the surrounding shroud. It’s important to know how much the blade has elongated based upon temperature in addition to the centrifugal force of rotation. On the other hand, if the parameter of interest is really stress, or its close relative, force, any strain caused by temperature changes would induce a true error in the result. A strain gauge used to measure the “g” forces on a supersonic aircraft wing skin might see temperatures from -45°C to +200°C. If the g-force information was critical to not overstressing the wing, you’d certainly not want significant temperature-induced error. In a more simple case, the load cell used to measure the force placed on a postal scale should not induce errors simply because the scale is next to the window on a sunny summer day!

Most applications fall into the second category, where the key measurement parameter is really stress, and the ideal system would be not to recognize any changes caused by thermal expansion or contraction. Like most engineering challenges, there is more than one way to skin this proverbial cat. They are: (1) Calculate the error and eliminate it mathematically, (2) Match the strain gauge to the part, (3) Use an identical strain gauge in another leg of the bridge. We’ve previously covered how to eliminate it mathematically, so lets take a closer look at choices 2 and 3.

Match the Strain Gauge to the Part Tested
The use of different alloys/metals allows manufacturers to provide strain gauges designed to match the thermal expansion/contraction behavior of a wide variety of materials commonly subject to strain (and stress) testing. This type of gauge is referred to as a “Self Temperature Compensated” (or STC) strain gauge. These STC gauges are available from a variety of manufacturers and are specified for use on a wide assortment of part materials. As you might imagine, the more common a metal, the better the chances are there is an STC gage that matches. However, you may count on being able to find a good match for such materials as aluminum, brass, cast iron, copper, carbon steel, stainless steel, titanium and many more. Though the match between the STC gauge and the part under test may not be perfect, it will typically be accurate enough from freezing to well past the boiling point of water. For more details on the precise accuracy to expect, you should contact your strain gauge manufacturer.

Use an Identical Strain Gauge in Another Leg of the Bridge
Due to the ratiometric nature of the Wheatstone bridge, a second, unstrained gauge (often referred to as a “dummy” gauge) placed in another leg of the bridge will compensate for temperature induced strain. Note that the dummy gauge should be identical to the “measuring” gauge and should be subject to the same environment.

Strain gauges tend to be small, and have short thermal time constants (i.e., their temperature changes very quickly in response to a temperature change around them), while the part under test may have substantial thermal mass and may change temperature slowly. For this reason, it is good practice to mount the dummy gauge adjacent to gauge being measured. However, it should be attached in such a way as not to be subjected to the induced strain of the tested part. In some cases, with relatively thin subjects and when measuring bending strain (as opposed to pure tensile or compressive strain), it may be possible to mount the dummy gauge on the opposite side of a bar or beam. In this case, the temperature impact of the gauges is eliminated and the scale factor of the output is effectively doubled.

Quarter, Half and Full Bridges
Strain gauges and measurement devices based upon strain gauges (e.g., load cells) can be configured in three different configurations. These are referred to as Quarter, Half and Full Bridges.

Quarter Bridge Strain Gauge

Quarter Bridge Strain Gauge

The quarter bridge gauge shown above is the simplest and probably most common strain gauge con-figuration (though some devices “based” on strain gauges are more likely to be provided in half or full bridge). The name “quarter” comes from the fact that in this configuration, the strain gauge represents one out of four, or one quarter of the resistors in the Wheatstone bridge. In this configuration, the user must supply the other three resistors.

Half Bridge Strain Guage

Half Bridge Strain Guage

In the half-bridge configuration, two resistors or half of the bridge are provided in the strain gauge itself. Half Bridge configurations have two advantages over the single bridge. First, they simply require the user to provide one less resistor. Second and more important, however, is the fact that most half bridge sensors automatically provide temperature compensation, made possible by having two identical gauges in the same side of the bridge.

As you might expect, the full bridge sensor shown below provides all four resistors, in effect, providing the entire bridge. All the measurement system needs to provide is an excitation voltage and a differential analog input. Like the half-bridge configuration, most full bridge gauges are temperature compensated.

Learn more about measuring output from a strain gauge.

Full Bridge Strain Guage

Full Bridge Strain Guage

Common DAQ Communication Interfaces

In an earlier post we covered the ARINC-429 bus for avionics data communications. Today lets look at the MIL-STD-1553 bus used in military and aerospace applications and the CAN-bus used in automotive applications.

MIL-STD-1553
MIL-STD-1553 is the military’s equivalent to ARINC-429, though structurally it is very different. The first and most obvious difference is that 1553 links are typically designed with dual, redundant channels. Though commercial aircraft don’t usually get wires cut by bullets or flak, military aircraft are typically designed such that a single cut wire or wiring harness won’t cause a loss of system control.

MIL-STD-1553 Bus Architecture

MIL-STD-1553 Bus Architecture

If you are looking to “hook” to a MIL-1553 device, be sure your interface has both channels. Also, a MIL-1553 device can serve as Bus Controller, Bus Monitor, or Remote Terminal. Not all interfaces support all three functions. Be sure the interface you select has the capability you require. As with the ARINC-429 bus, when operating as a bus controller, the unit must be capable of detailed transmission scheduling (including major and minor frame timing) and this is best per-formed in hardware rather than via software timing.

CAN
The CAN (Controller Area Network) bus is the standard communications interface for automotive and truck systems. Gone are the days when your car was controlled by mechanical linkages, gears, and high current switches. Your transmission now shifts gears based on CAN commands sent from a computer. Even such things as raising/lowering the windows and adjusting the outside rearview mirror are frequently no longer done via simple switches, but are now done via CAN sensors and actuators. Vehicle speed, engine RPM, transmission gear selection, even internal temperature are all available on the CAN bus.

As with the ARINC-429 aircraft example, when running tests in a car or truck, it’s very useful to be able to coordinate the data available on the various CAN networks with any more conventional DAQ measurement you may be making. If you are measuring internal vibration, you’ll want to coordinate it with Engine RPM and speed (among other things). Like any data acquisition system, one of the first things you need to be aware of when specifying a CAN interface system is how many CAN ports you will need. There are sometimes 50 or more different CAN networks in a given vehicle. Be sure your system has enough channels to grab all the data you still need. The CAN specification supports data rates up to 1 megabaud. Be sure the system you specify is capable of matching the speed of the network you wish to monitor.

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All Systems Go at AUTOTESTCON 2013

United Electronic Industries - Booth #501 at AUTOTESTCON 2013

United Electronic Industries – Booth #501 at AUTOTESTCON 2013 featuring the new MIL-CUBE DAQ platform!

Be sure to stop by to see us at AUTOTESTCON Booth #501 at the Schaumburg Hotel & Convention Center. We’re introducing the MIL-CUBE, a highly advanced data acquisition and intelligent I/O platform that’s designed to be compliant with MIL-STD-810 and MIL-STD-461 (power supply requirements). In contrast to some of our neighboring booths, ours features no bells, no whistles, just the best DAQ systems available and a couple of engineering experts to answer your questions!

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Error Sources in Data Acquisition & Control Systems

Continued from Part 1 of High Resolution Does Not Guarantee High Accuracy in Data Acquisition Systems

Input Offest Errors: Assuming all other errors are zero, input offset is a constant difference between the measured input and the actual input voltage. For example, if the input offset voltage was +0.1 volt, measurements of perfect 1, 2 and 5-volt input signals would provide readings of 1.1, 2.1 and 5.1 volts, respectively. Input Offset Error

In reality, the other errors are never zero, which complicates the measurement of input offset. Most system data sheets spec analog input as the input offset error at 0 volts. More advanced DAQ products, such as the DNA-AI-207, provide an “auto zeroing” capability. This function effectively drives the input offset error to zero or a level low enough that its contribution is no longer significant relative to other errors or signal of interest.

Gain Error: Lets illustrate this error by, again, assuming all other errors are zero. Gain error is the difference in the slope (in volts per bit) between the actual system and an “ideal” system. For example, if the maximum gain error is 1%, the gain error at 1 volt would be 10 millivolts, while the error at 10 volts would be ten times as large at 100 mV.

Gain error is defined as the error of the measurement as a percentage of the full scale reading. Using our 0 to 10 volt example range, if the error at 10 V is 1 mV, the gain error specified would be 100 x (0.001 / 10) or 0.01%. For higher precision measurement systems, the gain error is often specified in parts per million (ppm) rather than percent since it’s a bit easier to comprehend. To calculate the error in parts per million, just multiply the input error divided by the input range by one million. A 0.01% error would be equivalent to 1,000,000 x .001 / 10 or 100 ppm. Gain Error

Though many products offer auto-calibration to reduce the gain error, it is not possible to eliminate it completely. The automated gain calibration is almost always performed relative to an internally supplied reference voltage, which tends to drift over time and any error in the reference will translate into a gain error. It is possible to create references with arbitrarily small errors. However, as the gain error gets small relative to other system errors, it becomes economically unfeasible to improve the reference accuracy. In addition to the cost penalty involved in providing the “pseudo perfect” reference, one of the errors, if not the largest, in most references is drift over temperature. The only way to eliminate this drift is to maintain the reference temperature at a constant level. This is not only expensive, but it also requires a significant amount of power, which increases overall system power consumption.

Need help deciphering this, contact the data acquisition experts at UEI.

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Strain Gauge Measurements – Part 2

Picking up where we left off in Part 1…the scale factor of a strain gauge is referred to as its Gauge Factor, which depending on the source is commonly abbreviated as GF, Fg, or even K. The GF is defined by the equation GF = R / R0, where R is the change in resistance induced by the strain and Ro is the resistance of the “unstrained” gauge. The result is the induced strain (in units of length per unit of length (e.g., inches/inch)).

GF strain gauge outputs are relatively small in terms of the resistance change for strains in the area of interest. Most strain applications require a full-scale output in the region of ±1% strain. If we assume that GF = 2 and Ro = 120 ohms, the full scale output in terms of resistance is ±2.4 ohms. This is a pretty small output to measure. As such, most strain gauge measurement systems are based upon an electrical circuit referred to as a Wheatstone Bridge, shown here:

Wheatstone Bridge

The Wheatstone Bridge is designed to measure small changes in resistance without requiring ultra-high performance analog inputs. The classic Wheatstone bridge equation is:
Wheatstone Bridge Equation
Now we must solve this equation for the resistance value of the unknown. In this case, we will assume the strain gauge is inserted in place of Rc, and we need to solve for Rc. With a bit of algebra we arrive at the following equation where Rc is the calculated unknown; Vx is the excitation voltage; Vo is the output voltage measured by the DAQ system; and Ra, Rb, and Rd are bridge completion resistors.

Complex Equation

It’s a bear to calculate repetitively by hand, but easy to implement in Excel, LabView, or most any programming language. And once you have it, you won’t need to write it again. Also, you’ll note that there is no linear approximation in this equation, so it will work for larger changes, if the bridge is out of balance. In many cases, you may also simplify the equation because the bridge completion resistors Ra and Rb are typically equal values.

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ARINC Communication Interfaces

https://ueidaq.files.wordpress.com/2013/07/dna-429-566-512

Communications is an often overlooked aspect of data acquisition and control systems. Note that we’re not talking about the communications interface between the I/O device and the host computer. We’re referring to various devices to/and from which we either need to acquire data or issue control commands. Consider the ARINC-429 interface, commonly used in either a commercial aircraft or ship.

ARINC-429 is the avionics interface used by almost all commercial aircraft (though 429 is not the primary interface on the Boeing 777 and 787 and the Airbus A-380). It is used for everything from communicating between various complex systems such as flight directors and autopilots as well as for monitoring more simplistic devices such as airspeed sensors or flap position indicators.

In test systems, it’s often critical to coordinate data from ARINC-429 devices with more typical DAQ devices such as pressure sensors and strain gauges. When studying stress placed on a wing spar, you’d certainly like to be able to coordinate the stress results with such parameters as air-speed, altitude, and any turn or climb/descent induced g-forces.

While the ARINC-429 bus is well defined, computer based interfaces for the 429 bus are very different. The 429 bus defines functionality in terms of labels, with each label representing a different parameter. It’s important for the data acquisition system to be able to differentiate between the labels. If your system is only interested in airspeed, you want to ignore other parameters. Note that some ARINC-429 interfaces allow you to make these selections in interface hardware, while others place the burden of effort on the software.

Many ARINC-429 devices run on a definitive schedule. For example, the magnetic heading may be transmitted every 200 mS. Some ARINC interfaces count on software-based scheduling while others build the scheduling into an FPGA in the hardware. The more factors and parameters a given ARINC interface builds into hardware the better, as you may be counting on those precious host CPU cycles for other things.

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